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Product Name DC Laminated Busbar
Material polyester film (PET PE) NOMEX polyimide film (PI/KAPTON) epoxy board (FR-4) glass fiber laminate (GPO-3) Epoxy powder and other insulating materials
Product Description
The laminated busbar is to bond the insulating layer material and the multilayer conductor together by hot pressing, which is easy to design and integrate the busbar into the customer's product.
1. Alternate stacking of conductor layer and insulating layer
2. Types of insulation materials:
polyester film (PET, PE), NOMEX, polyimide film (PI/KAPTON), epoxy board (FR-4), glass fiber laminate (GPO-3) , Epoxy powder and other insulating materials
3. It is a multi-layer composite structure connection bar. Compared with the traditional, cumbersome, time-consuming and troublesome wiring method, the use of a composite bus bar can provide a modern, easy to design, fast installation and clear structure of power distribution system. It has repeatable electrical performance, low impedance, anti-interference, EMI/RFI shielding, good reliability, voltage drop, strong overload capability, reducing the damage of voltage spikes to components, extending (improving) the service life of electronic components, and reducing system noise And electromagnetic interference/radio frequency interference, convenient installation and on-site maintenance, reducing the number of parts, saving space, simple and fast assembly high-power modular connection structure components. Laminated busbars are widely used in rail transit, wind and solar inverters, industrial inverters, IGBTs, large UPS systems or other components that require power distribution.
Product parameters:
1. Insulation voltage: 300V-20KV
2. Rated current: 0-3600A 3. Product structure: hot pressing edge sealing, hot pressing unsealing, hot pressing tank sealing
3. Processing size: 1600x800mm
4. Flame retardant, etc. Group: UL94V -0
5. Conductor material: T2 CU, 1060AL
6. Conductor surface treatment: passivation, tin plating, nickel plating, silver plating, tin + silver 7. Connection method with device: embossing, copper pillar riveting, copper Column welding
8. Insulation resistance: 20MΩ-infinity
9. Partial discharge: less than 10PC
10. Temperature rise: 0-40K
Users can design products by themselves, and customize them by providing us with drawings. Users can also provide us with information about the actual application environment. We help customers design products.
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